crystalmark
Differences
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| crystalmark [2024/09/26 19:44] – epace | crystalmark [2025/06/11 17:03] (current) – bdincau | ||
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| - | ====== Crystalmark Etching Tool ====== | + | ====== Crystalmark Etching Tool - RETIRED |
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| - | ===== About ===== | + | ===== About (Legacy - tool disassembled after loss of performance) |
| - | The CrystalMark Etcher is located in the Microfluidics Lab on the middle table by the Haas CNC in 3430. It is attached to the [[sherline_cnc_mill|Sherline CNC Diamond Drill]]. | + | The CrystalMark Etcher is located in the Elings 3430 across from the microfluidics station |
| It uses air pressure and aluminum oxide abrasive to cut or etch patterns in materials such as glass or silicon. The kerf is about 800 microns wide. | It uses air pressure and aluminum oxide abrasive to cut or etch patterns in materials such as glass or silicon. The kerf is about 800 microns wide. | ||
crystalmark.1727379871.txt.gz · Last modified: 2024/09/26 19:44 by epace