Differences

This shows you the differences between two versions of the page.

--- crystalmark [2023/09/07 23:07] – [Crystalmark Etching Tool] bdincau
+++ crystalmark [2023/12/01 00:52] (current) – [About] colin
@@ Line 17: / Line 17: @@
 The CrystalMark Etcher is located in the Microfluidics Lab on the middle table by the Haas CNC in 3430. It is attached to the [[sherline_cnc_mill|Sherline CNC Diamond Drill]].
-It uses air pressure and aluminum oxide abrasive to cut or etch patterns in materials such as glass or silicon. The kerf of the cuts are 700 microns.
+It uses air pressure and aluminum oxide abrasive to cut or etch patterns in materials such as glass or silicon. The kerf is about 800 microns wide.
-Patterns and pre-programmed holes can be uploaded via .dxf files to a program called **insert program here**, and holes can also be added manually.
+Patterns and pre-programmed holes can be uploaded via .dxf files to a program which converts dxf patterns to g code, and holes can also be added manually. (See SOP for detailed instructions)
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   * Stepper motor mounts and couplers on X-, Y- and Z-axes
-  * 70-2800 RPM continuously variable by electronic speed control
   * Maximum CNC travel positioning speed: 22 in/min
   * Max clearance (table to spindle): 8.00″ (203 mm)